Manufacturing layers
Copper and non-copper layer roles, conductive features, drilled holes, slots and board profiles.
One intelligent PCB exchange file
Open the manufacturing and assembly data contained in an IPC-2581 file as a structured board with searchable layers, components and logical nets.
.cvg.xmlAGBoard reconstructs supported IPC-2581 stackup layers, pads, traces, arcs, filled features, drills, routed slots, components, packages and logical nets.
The result uses the same touch-first workspace as other AGBoard projects, with per-layer visibility and GPU-accelerated navigation.
Copper and non-copper layer roles, conductive features, drilled holes, slots and board profiles.
Component references, packages, placement side and rotations when included in the IPC-2581 data.
Search a net name and highlight the supported pads and conductive features assigned to it.
The same touch-first tools stay available from a phone or a larger iPad workspace.
This viewer covers IPC-2581 design exchange files, commonly delivered as .cvg or .xml.
Yes, when the source file contains supported component, package and logical net data.
No. The IPC-2581 file is parsed and rendered locally on the device.